• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    TANTAL CAPACITOR containing a tantand anode, made with a protrusion located on its front part, and current terminals, one of which is made in the form of a cap, characterized in that, in order to simplify the design, the second current output is made in the form of a stepped cylinder with a protrusion welded to the protrusion of the end part of the tantalum anode, the protrusions are filled with epoxy resin with viscosity. 200-800 Pz, on the surface of which and on the part of the topsides there is an epoxy resin layer with a viscosity of 10-200 Pz, while the cap is cylindrical.
    公开号:SU1145941A3
    申请号:SU802905800
    申请日:1980-04-11
    公开日:1985-03-15
    发明作者:Осава Мицуо
    申请人:Сони Корпорейшн (Фирма)；
    IPC主号:
    专利说明:

    3 3 7
    /

    SP
    from 4
    Wickle "The invention relates to radio engineering, namely to the structure of a tantalum condenser, and can be used in its manufacture. The closest in technical essence to the present invention is that a tal polymer capacitor containing a taital anode made with a tongue located on its toroidal part and tokovods, one of which is made in the form of a cap Cll. Its drawbacks are design complexity, greater labor intensity of manufacturing, and also the difficulty of obtaining the required nominal value. Moreover, such a capacitor has a low reliability. The purpose of the invention is to simplify the design. The goal is achieved by the fact that in a tantalum capacitor containing a tantalum anode, made with a protrusion located on its front part, and current terminals, one of which is made in the form of a pack ring, the second current terminal is made in the Bi-hell of a stepped cylinder with a protrusion welded to the ledge butts of the tantalum anode, the protrusions are filled with epoxy resin with a viscosity of 200-800 Pz, on: the surface of which and on the part of the tops are an epoxy resin layer with a viscosity of 10-200 Pz, while the cap is cylindrical. FIG. 1 shows a tantalum capacitor; FIG. 2 is a section through a tantalum condenser; FIG. 1, mounted on a printed circuit board, the device contains a tantalum anode 1, a ledge 2 of the tantalum anode kolp.achok 3, a second toggle 4, a protrusion 5 of the second toggle, welding point 6 to the protrusion, epoxy resin 7 with viscosity 200-800 resin 8 with viscosity - 10-200 P solder 9, printed circuit board 10, conductor 1-1, conductor 12, glue 13, T4 solder. Cap 3. is molded from metal, for example iron, and plated with an alloy, for example, from 90% tin and 10% solder. Almost half of the cylindrical tantalum anode 1 is inserted into cap 3. Tantalum anode 1 is attached to cap 3 by means of solder 9. Thus, the first 1 , 2. ; electrically connected to the latter. The protrusion 2 departs from one end surface of the tantalum anode 1, the second toe-out 4 is made by cutting copper bars or brass bars and is clad with an alloy of 90% tin and 10% solder. The protrusion 5 of the second output terminal is made completely with the end surface of the second output terminal 4. The upper ends of the projections 5 and 2 are electrically connected by means of a welded joint. The tantalum capacitor is embedded in epoxy resin with the exception of one part of the cap 3 and. one second inlet terminal 4. Before pouring the tantalum capacitor into the epoxy resin, the protrusion 2 of the tantalum anode and the protrusion 5 of the second outlet are molded into epoxy resin 7 with a relatively high viscosity index of 200-800 Pz to ensure a stable connection between each other of the tantalum anode and the second terminal. Examples of sizes. The main parts of the tantalum capacitor. The outer diameter f of the cap 3 is. 2.2 mm. The thickness 0. and the protrusion 2 of the tital anode and the protrusion 5 of the second terminal are equal to 0.5 mm. The total length L of the tantalum capacitor is 6 mm. The height of the cap 2 is 1.5 mm. Tantalum, the capacitor is made as follows. First of all, the inner surface of the cap 3 is coated with a paste of solder and inserted into the cap 3 of the tantalum anode 1 thus coated. Then, it is preformed according to the shape shown in FIG. 1, the protrusion 5 of the second current output is welded to the protrusion 2 of the tantalum anode of tantalum material, which has previously been shaped, shown in FIG. 1, at the point of connection. . nothing The tantalum anode and the second terminal 4 are molded into an epoxy resin with a resin capacity of 200-800 Pz. Then they are molded into epoxy resin with a viscosity of 10-200 Pz. So get a tantalum capacitor. : A tantalum capacitor is mounted on the .10 circuit board of the printed circuit together with other elements, as shown in FIG. 2. On board 10 of the printed circuit is formed from copper-foil about 31
    The water springs 12 and 11. The tantalum capacitor is mounted on the printed circuit board 10 so that the cap. 3 and the second terminal 4 were in contact with the conductors 11 and 12 and temporarily attached to the printed circuit board 10 by means of glue 13. The printed circuit board 10 was immersed in a solder bath together with the tantalum capacitor and then removed from the bath
    5941 - 4
    . solder. Thus, the cap 3 and the second output terminal 4 are electrically connected to the conductors 11 and 12 by means of the solder 14.
    The technical and economic effect compared to the known one is that it is easy to manufacture, fewer parts increase the volume of it and increase reliability.
    J 7 to 2 6135 7 Put.g
    权利要求:
    Claims (1)
    [1]
    Tantalum capacitor containing a tantalum anode made with a protrusion located on its end part, and current outputs, one of which is made in the form of a cap, characterized in that, in order to simplify the design, the second current output is made in the form of a stepped cylinder with a protrusion welded to the protrusion of the end part of the tantalum anode is lined with epoxy resin with a viscosity of 200-800 Pz, on the surface of which and on the part of the current leads there is a layer of epoxy resin with a viscosity of U-200 Pz, while the cap is cylindrical.
    FIG. 1
    145941 2
    类似技术:
    公开号 | 公开日 | 专利标题
    SU1145941A3|1985-03-15|Tantalum capacitor
    US6188566B1|2001-02-13|Solid electrolytic capacitor having a second lead with a throughhole filled with an arc-extinguishing material
    US4591951A|1986-05-27|Mounting arrangement for electronic components
    US4231075A|1980-10-28|Solid electrolyte capacitor
    US4935848A|1990-06-19|Fused solid electrolytic capacitor
    US4675790A|1987-06-23|Three terminal electrolytic capacitor for surface mounting
    JP3229121B2|2001-11-12|Structure of solid electrolytic capacitor
    US3516150A|1970-06-23|Method of manufacturing solid electrolytic capacitors
    US4179725A|1979-12-18|Conformally epoxy coated electrolyte capacitor having axial leads
    US4110816A|1978-08-29|Installation of electrical components, particularly solid electrolytic capacitors in metal housings
    JP3479570B2|2003-12-15|Structure of package type solid electrolytic capacitor
    JPH01151228A|1989-06-14|Manufacture of solid electrolytic capacitor
    EP0169261B1|1989-10-11|Electronic component
    JPS6466925A|1989-03-13|Chip-shaped solid electrolytic capacitor with fuse
    JPS5773916A|1982-05-08|Small-sized inductor and preparation thereof
    JPS63265418A|1988-11-01|Chip-shaped solid-state electrolytic capacitor with fuse and manufacture thereof
    JPH01117313A|1989-05-10|Chip-like solid electrolytic capacitor with fuse and manufacture thereof
    JP2845010B2|1999-01-13|Solid electrolytic capacitors
    JPH01109711A|1989-04-26|Composite chip-type solid electrolytic capacitor
    JP3378285B2|2003-02-17|Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor
    JPS63299307A|1988-12-06|Electrolytic capacitor
    JPH02256221A|1990-10-17|Manufacture of chip-type solid state electrolytic capacitor
    KR810002375Y1|1981-12-18|Solid electrolytic capitors
    KR890000279Y1|1989-03-08|Solid electrolytic condenser
    JP3033647B2|2000-04-17|Fused solid electrolytic capacitor and method of manufacturing the same
    同族专利:
    公开号 | 公开日
    US4349860A|1982-09-14|
    JPS6026289B2|1985-06-22|
    GB2046995B|1983-03-30|
    CA1150374A|1983-07-19|
    JPS55138225A|1980-10-28|
    GB2046995A|1980-11-19|
    FR2454170A1|1980-11-07|
    FR2454170B1|1983-07-01|
    NL8002165A|1980-10-15|
    DE3013610A1|1980-10-23|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE4243897A1|1991-12-27|1993-07-29|Rohm Co Ltd|CA659368A|1963-03-12|Seidel Eberhard|Capacitor for use at high operating voltages|
    US2930951A|1957-07-08|1960-03-29|Gen Electric|Electrical capacitor|
    NL252101A|1959-05-30|
    US3341752A|1965-02-24|1967-09-12|Sprague Electric Co|Spring clamp connector mounted capacitor|
    US3344316A|1965-08-17|1967-09-26|John P Stelmak|Electrical connection of components to printed circuits|
    US3612963A|1970-03-11|1971-10-12|Union Carbide Corp|Multilayer ceramic capacitor and process|
    US3855505A|1972-04-03|1974-12-17|Nat Components Ind Inc|Solid electrolyte capacitor|
    US3795844A|1973-02-26|1974-03-05|Sprague Electric Co|Electronic component package|
    US3828227A|1973-04-09|1974-08-06|Sprague Electric Co|Solid tantalum capacitor with end cap terminals|
    US4090288A|1976-03-15|1978-05-23|Sprague Electric Company|Solid electrolyte capacitor with metal loaded resin end caps|
    US4085435A|1976-06-14|1978-04-18|Avx Corporation|Tantalum chip capacitor|US4488204A|1983-11-01|1984-12-11|Union Carbide Corporation|Device for use in making encapsulated chip capacitor assemblies|
    FR2558984B1|1984-01-31|1986-07-11|Tekelec Airtronic Sa|ELECTRICAL ELEMENT SUCH AS A TANTALUM AND SOLID ELECTROLYTE CAPACITOR|
    US4561041A|1984-08-22|1985-12-24|Union Carbide Corporation|Escapsulated chip capacitor assemblies|
    US4581479A|1984-11-16|1986-04-08|Moore Theodore W|Dimensionally precise electronic component mount|
    US4757610A|1986-02-21|1988-07-19|American Precision Industries, Inc.|Surface mount network and method of making|
    US4818823A|1987-07-06|1989-04-04|Micro-Circuits, Inc.|Adhesive component means for attaching electrical components to conductors|
    DE3824008A1|1988-07-15|1990-01-25|Contraves Ag|ELECTRONIC CIRCUIT AND METHOD FOR THE PRODUCTION THEREOF|
    US4984134A|1990-01-16|1991-01-08|Avx Corporation|Surface mount non-polar tantalum capacitor|
    US5412533A|1993-06-22|1995-05-02|Rohm Co., Ltd.|Solid electrolytic capacitor and manufacturing method thereof|
    US10388464B2|2016-09-19|2019-08-20|Biotronik Se & Co. Kg|Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP54045610A|JPS6026289B2|1979-04-13|1979-04-13|
    [返回顶部]